Challenges in introducing high-density interconnect technology in printed circuit boards for space applications

Reliability Assessment of Voided Microvias in High Density Interconnect Printed Circuit Boards under Thermo Mechanical Stresses

Title of Document: RELIABILITY ASSESSMENT OF VOIDED MICROVIAS IN HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARDS UNDER THERMO MECHANICAL STRESSES Roozbeh Bakhshi, Master of Science, 2013 Directed By: Professor Michael Pecht, Department of Mechanical Engineering Microvias allow signal and power transmission between layers in high density interconnection printed circuit boards. Presence of voidi...

Recycling of Printed Circuit Boards

Printed circuit boards (PCBs) can be found in any piece of electrical or electronic equipment: nearly all electronic items, including calculators and remote control units, contain large circuit boards; an increasing number of white goods, as washing machines contains circuit boards for example in electronic timers. PCBs contain metals, polymers, ceramics and are manufactured by sophisticated te...

Pyrolysis of Printed Circuit Boards

Printed Circuit Board (PCB) is an essential component of almost all electrical and electron ic equipments. The rapid growth of the use of such equipments has contributed enormously to the generation of large quantity of waste PCBs. The WPCBs not only contain valuable metals but also a large variety of hazardous materials. Conventional treatments of such WPCBs have their own limitations. By pyro...

Crosstalk on Printed Circuit Boards

This document treats the crosstalk between parallel conductors. The conductors can represent either conductors in a multiconductor cable or traces on a printed circuit board (PCB). An analysis method based on a lumped circuit equivalent for the problem as well as a method to calculate the per unit length parameters are presented. The computed results are validated by comparison with measurement...

Flame Retardants in Printed Circuit Boards